Wafer cleaning is a crucial, repetitive step in semiconductor manufacturing. It impacts product yield and reliability by effectively removing unwanted microscopic materials, including chemical residues similar to the device films.
PTW SpinTec’s single-wafer spin technology offers the required process flexibility and high productivity to handle a broad spectrum of wafer cleaning steps throughout the entire manufacturing process flow effectively.
Key Applications
- SIC, Si, GaAS …
substrate processing - Thin wafer processing (warped wafer)
- Particle, polymer and residue removal
- Backside/bevel cleaning Silicon substrate thinning/stress relief
Application Range
- Substrate-, Film-, Metal Etch
- Surface-, Post CMP-, Pre EPI Clean
- Bevel Etch & Clean
- Backside Film Removal